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Customized Zirconia Alumina Ceramic Wafer Plate Substrate High Hardness

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Customized Zirconia Alumina Ceramic Wafer Plate Substrate High Hardness

Customized Zirconia Alumina Ceramic Wafer Plate Substrate High Hardness
Customized Zirconia Alumina Ceramic Wafer Plate Substrate High Hardness Customized Zirconia Alumina Ceramic Wafer Plate Substrate High Hardness Customized Zirconia Alumina Ceramic Wafer Plate Substrate High Hardness Customized Zirconia Alumina Ceramic Wafer Plate Substrate High Hardness Customized Zirconia Alumina Ceramic Wafer Plate Substrate High Hardness

Large Image :  Customized Zirconia Alumina Ceramic Wafer Plate Substrate High Hardness

Product Details:
Place of Origin: Henan, China
Brand Name: Spark
Model Number: Ceramic Plates
Payment & Shipping Terms:
Minimum Order Quantity: 2-10 PCS
Price: USD16.50/PC
Packaging Details: Cartons or fumigation free wooden boxes
Delivery Time: 15-45 days
Payment Terms: L/C, T/T, Western Union
Supply Ability: 100000 Pieces per Month

Customized Zirconia Alumina Ceramic Wafer Plate Substrate High Hardness

Description
Material: Alumina Ceramic Type: Ceramic Plates
Color: White Product Name: Alumina Ceramic Plates
Feature: High Hardness Application: Industrial Ceramic
High Light:

Customized Alumina Ceramic Wafer

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Alumina Ceramic Substrate Wafer Plate

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High Hardness Alumina Ceramic Wafer Plate

Alumina ceramic plates
Alumina ceramic plates can withstand high temperature and maintain high strength and hardness. And it also has superb performances in electrical insulation, high chemical resistance, good were resistance and heat resistance, and low thermal expansion.
Advantage
1) A variety of specifications available. 2) Satisfy various technical request 3) Lower medium spoilage 4) Good insulation performance and high temperature resistance 5) Stiffness texture
Technical Parameters
Property
Units
 
Al2O3 Content
%
96
98
99.5
99.7
Density
g / cm3
3.70
3.80
3.90
3.92
Color
-
White
White
Ivory
Ivory
Compressive Strength at 25 C
Mpa
2229
2091
2512
2350
Tensile Strength at 25 C
MPa
200
200
248
252
Flexural Strength at 25 C
MPa
331
276
324
320
Elastic Modulus at 25 C
GPa
290
331
366
380
Hardness : Knoop Rockwell
(Gpa) Kg/mm2
R45N
(11.7) 1196
79
(12.5) 1276
77
(14) 1428
85
(15) 1510 90
Thermal Conductivity at 25 C
W / m-Deg K
20.8
28.1
30.7
31.6
Coefficient of Thermal Expansion at 25-1000 C
1 X 10-6 /
Deg C
7.9
8.5
8.1
8.0
Specific Heat at 25 C
cal / g / Deg C
.184
.184
.182
.180
Maximum Working Temp.
Deg C
1650
1650
1700
1700
Volume Resitivity
at 25C at 700 C
ohm-cm
ohm-cm
1 X 10-13
1 X 10-8
1X 10-13
2.2 X 10-9
1 X 10-13
6 x 10-7
1 X 10-13
6 x 10-7
Dielectric Strength
(at Thickness) 100Mils
ac volts
per mil
350

340
335
330
Dielectric Constant 1Mhz
at 25C
e' / eo
8.6
9.4
9.7
10.0
Dissipation Factor 1 Mhz
at 25C
Tan Delta
.0004
.0003
.0003
.0002

Contact Details
SPARK INDUSTRY (HENAN) CO.,LTD

Contact Person: Richard Fan

Tel: 13917806325

Send your inquiry directly to us (0 / 3000)